PT610 perfluoropolymer resin combines ultra-low dielectric constant, high Exceptional permeability, impeccable chemical and thermal stability, perfect water and oil resistance, and excellent biocompatibility. With our state-of-the-art monomer molecule design, the steric interactions involving several perfluoro functional groups in this polymer lead to a highly congested chain structure, which gives PT610 resin unique film-forming property and good physical strength. Its modulus is comparable to many fluorinated polyimides. PT610 resin is easy to mold, spin cast or made into dispersion or solution. It can perfectly serve as passivation layers and encapsulation for hybrid/sandwich integrated circuit packaging, 3D chip packaging, and dielectric material for next generation of 5G devices which require ultra-low dielectric loss and zero tolerance of signal delay.